Translation: Intel EMIB packaging grows rapidly - silicon capacitors also take off with it Silicon capacitors are expected to experience explosive growth in the field of AI semiconductors. It has been found that Intel is planning to adopt silicon capacitors on a large scale starting next year to enhance the performance of its self-developed 2.5D packaging technology "EMIB". The most clear and visible source of demand is Google. Google plans to launch its next-generation AI accelerator "v8e" in the second half of next year and has already adopted an EMIB substrate with embedded silicon capacitors for the chip. Due to other large tech companies such as Amazon currently using EMIB, analysts suggest that demand may sharply increase. According to industry sources on the 27th, Intel plans to use silicon capacitors in its 2.5D packaging starting next year. Intel uses' silicon capacitors' in 2.5D package... Google AI chip first applied 2.5D is an advanced packaging technology that inserts a thin film spacer between the semiconductor and substrate. Due to its ability to connect circuits at higher densities compared to traditional packaging that only uses substrates, the demand in the fields of AI and HPC (high-performance computing) is constantly increasing. To improve the cost-effectiveness of 2.5D packaging, Intel has designed its own technology called EMIB. EMIB does not use a large area of interlayer, but rather connects chips to each other through a small silicon bridge. Due to the fact that silicon bridges only need to be placed at the locations where chip to chip connections are required, chips can be arranged in a more flexible and efficient manner. Recently, EMIB has received attention as an alternative solution to TSMC, which has been leading the existing 2.5D packaging market. This is because, against the backdrop of rapid development in the AI industry, TSMC's 2.5D packaging capacity is facing a supply shortage. In fact, global tech giant Google is also paying attention to EMIB. Google has decided to adopt EMIB for its self-developed AI semiconductor "v8e" planned to be launched in the second half of next year. Under this architecture, TSMC is responsible for chip mass production, MediaTek is responsible for design and manufacturing support, and Intel is responsible for packaging. However, there has always been a concern that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors with huge power consumption. To this end, Intel plans to introduce new technologies such as silicon capacitors and through silicon vias (TSV) to ensure the packaging stability of v8e. Capacitors are components in electronic circuits that store and release electricity. As for silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than traditional multilayer ceramic capacitors (MLCC), which can minimize signal loss generated in high-performance semiconductors. They can also be designed into ultra-thin structures based on silicon wafers, achieving high-density integration. A semiconductor industry insider explained, "Due to the voltage drop phenomenon that occurs in the high-frequency area inside AI chips, it is difficult to solve it with MLCC. We understand that Intel is using silicon capacitors as a solution. He added, "The relevant supply chain is now in place, and mass production will officially begin next year EMIB-T has entered a growth track - related ecosystems and markets are expanding together Intel has also inserted TSV as a power supply channel in the silicon bridge. The key is that by using TSV to shorten the power path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel refers to this as "EMIB-T. The industry expects rapid growth in the EMIB-T and silicon capacitor markets. This is because Ibiden in Japan, one of the main companies producing semiconductor substrates for EMIB-T, is actively promoting capital investment. Feidian had previously planned to build the Gama, Kama factory in Gifu Prefecture as a substrate factory for Intel CPUs. However, it postponed the plan and decided in the first half of this year to officially convert the Gama factory into a production line for EMIB-T substrates. The investment amount is 220 billion yen (approximately 2.1 trillion Korean won). In its recent financial report release, Feidian stated that the Gama factory will begin operations in 2027 and enter full production in 2028. And it was added that the production capacity of EMIB-T substrates is currently far behind demand. However, further increasing production capacity is quite difficult, so we are discussing various options with our clients. '' A semiconductor industry insider explained, 'Feidian specializes in EMIB-T production lines, with most of the investment coming from customers such as Google, Amazon, and Intel.'. He added, "This indicates that AI semiconductors based on EMIB-T will significantly grow in the future, and silicon capacitors are likely to expand accordingly