Potential trading opportunity (semiconductor related non mouse warehouse) DOW The overall order is not large, but there is a specialized electronic materials business line, or it is expected to benefit from advanced packaging orders Dow is accelerating cost optimization and energy/data center layout (strongly related to semiconductors/AI) ———————— Dow has a dedicated Electronics business line that provides high-purity materials and silicone solutions, directly serving semiconductor manufacturing and advanced packaging: Advanced Semiconductor Packaging and MEMS: using DOWSIL ™ Series of silicone materials, providing thermal interface materials (TIMs), thermal conductive encapsulation adhesives, conformal coatings, optical adhesives, etc. Key product: DOWSIL ™ TC-6015 thermal conductive encapsulation adhesive (used for 5G and AI chip heat dissipation) DOWSIL ™ CC-8030 UV conformal coating ELECPURE ™ High purity electronic grade solution (used for high-purity cleaning/processing in semiconductor, display panel, PCB manufacturing). Application scenarios: chip packaging, wafer level packaging, data center liquid cooling systems, 5G base stations, consumer electronics, etc. Dow emphasizes high thermal conductivity, high purity, low-carbon sustainable solutions, and directly supports AI/semiconductor computing infrastructure. —————— On May 18, 2026, the NRC released an environmental assessment report, giving a "no significant impact" (FONSI) designation to Dow and X-energy's Texas Advanced Nuclear Power (SMR) project - planning to deploy small nuclear reactors at Dow's factory to provide clean electricity and steam (to support energy transition). May 18, 2026: Dow Coolant Care Network is launched - a one-stop data center liquid cooling management service network (based on DOWFROST and other heat transfer fluids), simplifying AI/data center cooling operations and directly serving semiconductor computing infrastructure. On January 29, 2026, the "Transform to Outperform" strategic transformation plan was launched with the goal of adding at least $2 billion in operating EBITDA and enhancing competitiveness through measures such as AI/automation, simplified operations, and layoffs of approximately 4500 people (already implemented).