[Korean Media: ASML Developing Wafer-to-Wafer Hybrid Bonding Equipment, Expected to Significantly Shorten Production Cycles] Golden Finance reported on April 29, citing Korean media outlet The Elec, that Professor Joo Seung-hwan from Inha University in South Korea revealed at an advanced packaging technology conference held in Seoul that, through patent analysis, Dutch lithography giant ASML may be leveraging its flagship lithography platform Twinscan's technological advancements to develop wafer-to-wafer (W2W) hybrid bonding equipment. The Twinscan platform, with its dual wafer stage design, has significantly improved manufacturing efficiency. If this technology is applied to W2W hybrid bonding equipment, it is expected to greatly shorten the production cycle for direct bonding of two wafers. This latest development indicates ASML's attempt to extend its dominance in the lithography field to the packaging sector. (Dongxin News Agency)